Electronics Forum: package on package soldering (Page 1 of 111)

Latent shorts on QFN package

Electronics Forum | Wed Mar 04 08:21:42 EST 2009 | rgduval

It seems familiar, but nothing that I've actually experienced. I've read some articles about tin-whiskering in lead-free solder. I think NASA has some pretty good analysis (or, at least they did a couple of years ago). The summary is that without

Latent shorts on QFN package

Electronics Forum | Tue Mar 03 14:07:07 EST 2009 | macisaint

I'm having shorts appear on my QFN packages between pins, usually only after a week or so of power-on operation. The shorts are 1K and slowly down to hard shorts over time. Typically a defective part will have failures on multiple pins. I tried havi

Flux package

Electronics Forum | Fri Jan 26 09:37:42 EST 2001 | blnorman

Our current solder paste vendor wants us to evaluate a paste. One of the selling points is that this paste (SnPb) will have the same flux package that will be used with some of their lead-free pastes. We are looking at going to SAC when we go lead-

CERSOT-23 solder on top of package

Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad

I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package

CERSOT-23 solder on top of package

Electronics Forum | Tue Jul 25 14:30:04 EDT 2017 | emeto

Looks like you have a great wetting of your paste :). Once body has been in contact with molten solder, the package could suffer damages on the body(outside and inside) and on the circuitry inside. It is considered a defect. I have seen that before a

Latent shorts on QFN package

Electronics Forum | Fri Mar 06 19:58:59 EST 2009 | macisaint

ENIG

Latent shorts on QFN package

Electronics Forum | Mon Mar 09 07:14:35 EDT 2009 | gregoryyork

wow enig is usually not associated with this failure

Latent shorts on QFN package

Electronics Forum | Wed Mar 04 08:25:49 EST 2009 | scottp

I don't think anyone can give you an answer until you've had some failure analysis done. Silver migration? Dendritic growth? Tin whiskers? Lots of possibilities, but you won't know without failure analysis.

Latent shorts on QFN package

Electronics Forum | Fri Mar 06 19:40:34 EST 2009 | gregoryyork

I would imagine it is lead free HASL finish board from the sounds of it am I right. Cheers Greg

Latent shorts on QFN package

Electronics Forum | Wed Mar 04 11:47:42 EST 2009 | patrickbruneel

I have to correct something from my previous post (before someone else corrects me). You can grow dendrites from any conductive surface (Cu, Ni etc.) but the final stage would be lower SIR. In my experience other metals except for tin do not lead to

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