Electronics Forum | Mon May 22 10:41:50 EDT 2000 | Scott G
Can anybody provide information on shear testing of passive components. What standards are used etc. Thanks
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Sat Mar 31 08:47:24 EST 2001 | davef
Sure, researchers measure shear as an element of their material characterization process, but that does not make it an acceptance test. [Truly, this conversation is not uncommon on SMTnet. So, it would not surprise me if an enterprising something o
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Tue Oct 26 16:31:50 EDT 2010 | sai
All of the Mydata machine comes with a standard library package; 0402,0603,0805,1206, soic8 and so on.
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
Electronics Forum | Tue Oct 24 13:41:25 EDT 2006 | jax
Everybody who uses basic "part-type" naming conventions for machine package codes will have this same issue unless restrictions are placed on who, how, and when the package codes can be altered. Some alternative methods to solving this problem: 1. U
Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Wed Mar 26 09:19:20 EDT 2008 | nibirta
hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts /
