Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Jun 18 21:46:27 EDT 2001 | davef
It's possible that combining these two fluxes is benign, you sure can't say your customer is wrong, can you???? So, what is the intent of leaving these two different flux materials on your board? What is the residue remaining on your board as your
Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c
DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after
Electronics Forum | Thu Feb 03 21:20:50 EST 2000 | Dave F
Ignacio: Try: Electronic Packaging & Interconnection Handbook, Harper, (ISBN 0070266948) Printed Circuit Board Materials Handbook Jawitz, MW McGraw-Hill 1997 (ISBN 0070324883) merix.com/resourcecntr/materials/mtl_property_comp.html norplex.com/TD_L
Electronics Forum | Mon Jan 31 21:11:09 EST 2000 | Dave F
Dave: Find: "Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology", by J. Clech et.al. IEEE Trans on Comp. Hyb. and Manuf. Tech. Vol. 16, No. 8 Dec. 1993, p.949. It listed cycle to failure
Electronics Forum | Fri Dec 31 20:21:26 EST 1999 | Stu Leech
Intel had a similar problem with one of their military packages. They had "dull" leads. QC screamed loudly about this because the "dull" leads looked like a solder-coating problem. (Actually the solderability was equal or better than the "shinny" lea
Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin
please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t
Electronics Forum | Mon Dec 06 12:00:39 EST 1999 | Dave F
Peter: try: Aries 908.996.6841 Antona 310.473.8995 Oztech 510.782.2654fax2656 Emulation Technologies 408.982.0660 fax 0664 Interconnect Systems (BGA/BGA, BGA/QFP, BGA/PGA) 708 Via Alondra Camarillo CA 93012 805.482.2870 fax 8470 isipkg.com Good lu
Electronics Forum | Fri Nov 19 13:37:10 EST 1999 | JAX
I have recently started programming Siemens equipment (Monday) and am a little confused on some issues. When inspecting BGA packages does the machine locate a corner ball and use it as an anchor to locate the rest? If not how does it know that it has
Electronics Forum | Mon Nov 15 09:57:09 EST 1999 | Larry Johnson
Hello all.... Can anyone out there tell me the correction package orientation or "industry standered" (in tape and reel) for a SOT-223. We are getting them in both directions from multiple vendors. To save confusion, do the "three little legs" poin
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