Electronics Forum: packages (Page 116 of 288)

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Fri Apr 17 15:06:57 EDT 1998 | Justin Medernach

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

Argon Leaking Rate

Electronics Forum | Wed Apr 15 09:59:56 EDT 1998 | Miangui Xue

I have a hermetic package with 1 atm of Helium (5% vol.) and Argon (95%) inside. We have detected the helium leaks at 5*e-8 ccatm/sec. My question is what is the leaking rate of argon. Can anybody provide any insight or information to calculate the r

TCP - How to place & solder

Electronics Forum | Thu Mar 19 03:15:45 EST 1998 | Leonard Wesson

We are a small company that specializes in upgrading portable computers. We are now wanting to venture into Pentium upgrades which requires removal & resoldering of TCP - Tape Carrier Package CPUs. How is this done? We currently rework SMT without

IC packaging Specs

Electronics Forum | Sat Feb 28 14:00:18 EST 1998 | Gary Simbulan

I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feeder

Re: IC packaging Specs

Electronics Forum | Thu Mar 19 17:02:50 EST 1998 | TaeDong Park

| I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feed

Packing material, the right track ?

Electronics Forum | Thu Aug 23 11:55:21 EDT 2001 | wbu

TA, is there somebody out there who can bring on the right track according adequate materials for long term storage of assembled boards (at least 10 years)? It�s for spare parts for future service exchange. The units should be stored seperately and

Odd Form parts

Electronics Forum | Mon Sep 10 08:42:18 EDT 2001 | caldon

How do these components come packaged? Bulk, Reel, Tray,.... Some of the work bench manufacturers have X-Y pick ups for manual assembly. These x-y pick ups should fit over an inspection conveyor. Sorry I am drawing a blank when it comes to manufactu

BGA,s Storage

Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef

There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust

Temperature sensitive part

Electronics Forum | Thu Dec 13 21:02:38 EST 2001 | davef

Contact the fabricator of this part for their recommendations. There is about as many different approaches to soldering thermistors as there is thermistors. You imply that this is a SMT style package. If that is correct, it's curious that the comp

What does MSL 4 on a component package means?

Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy

Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to


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