Electronics Forum | Tue Jan 24 03:42:54 EST 2006 | aj
what problems are you having, does your machine software support BGA . Are you downloading the Part Data sheet with all the dimensions , pitch etc. If you want to tell me a BGA package that you are having problems with I will send you Part Data.
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Mon Feb 27 05:58:57 EST 2006 | Rob
Chunks is right, in the main the termination material is the only change. However, plastics have changed & the ones free of nasty chemicals (polybrominated whatevers)are actually less temperature tolerant. Also some manufacturers do publish PBT (pe
Electronics Forum | Mon May 01 05:47:29 EDT 2006 | aj
Hi, Did you sell the PC that you had Flexa Installed on as part of the package? If so , you should have no problems. Fuji should just send the updates directly to the new customer. If there is a fee for this so be it , its not your problem.( in hind
Electronics Forum | Wed May 10 16:01:37 EDT 2006 | Hoss
We are looking for a tool to perform BOM comparisons. I know that Aegis and Valor provide this capability within their CAM offerings. I'm trying to find something that I don't need infrastructure to utilize and won't break the bank. Anyone who use
Electronics Forum | Thu May 25 18:32:12 EDT 2006 | pms
Having an issue with our paste inspector (human type). Were printing paste on .5mm pitch pads (MLF package). My question is - What is the acceptable print deviation (percentage) off the pad before you see problems after reflow? 0%? 1%? 10%? 25%?
Electronics Forum | Fri Jul 21 11:56:30 EDT 2006 | CKH
Hi Folk, i encounter some components mounted in the different Orientaion (Wrong Orientation). i am puzzle on this.... All these components come in Tape & Reel form. i can only deduce that the Component Wrong Orientation might come from its origina
Electronics Forum | Mon Jul 24 02:47:25 EDT 2006 | emeto
Hi CKH, If the problem is on the current board type only, the problem is in the fiducials or in the CAD data. If the problem remains on all boards(different product) it is definetly a machine calibration problem. Did you try to reteach the board one
Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef
JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *
Electronics Forum | Tue Aug 22 12:04:11 EDT 2006 | rlackey
No, not by us mere mortals but where there WML there's hope. I'm not convinced the package would like around 260C either. Disclaimer: Please note I am just a simple engineer and was not privileged enough to attend Soltec University, instead having
