Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Tue Feb 13 14:59:48 EST 2001 | vargas_s
I have an application where a customer cannot get a 14 lead TSSOP device in time for his needs (his board design is fixed). He can however get the same device in a 16 lead SOIC wide body package (two leads are not used). Has anyone come across a cost
Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette
To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive
Electronics Forum | Wed Feb 21 09:01:16 EST 2001 | Donnie
Thanks for the input. We currently have both the Waverider and Kic products in house. We use the WaveRider on all our waves, and the Kic for the ovens. We want to find a product for our ovens that's a little more up to date than the Kic. I'm looking
Electronics Forum | Fri Feb 23 10:24:24 EST 2001 | johnthor
We still build a legacy product with a primitive backplane using silver plated fork terminals for outside world connections. After some 20 years of no problems the fork terminals on raw stock PCBs were black and almost unsolderable. Because of the
Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink
I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret
Electronics Forum | Thu Mar 22 15:45:20 EST 2001 | pteerink
I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so mine pass spec, although they are not pr
Electronics Forum | Wed Apr 04 08:28:27 EDT 2001 | Cal
ZAM_BRI- I don't know how effective this may be but some points to include in the buy-off procedure: Before submitting the PO for the stencil you may also want to do a CAD to Stencil comparison to verify correct apertures.There are SW packages and co
Electronics Forum | Mon Dec 18 14:49:23 EST 2000 | Charles Harper
Probably the most important recent event has been the acquisition of International Flexible Technologies by Scheldahl,whose strength in flexible materials will have a major growth impact for flexible circuits--already growing nicely.Also,continuing a
