Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
Electronics Forum | Mon Aug 03 20:17:43 EDT 1998 | Dave Kalen
(fishing).. | Has Sanyo developed a bulk feeder for 201's and do you feel that bulk feeding will be the next big move in placement equipment? | In New England people are talking bulk feeding, but few people have elected to go that way. | As wit
Electronics Forum | Fri Jul 10 14:16:06 EDT 1998 | Bob Willis
As Steve said there should not be a problem with cracking plastic components but if you are reaching 180c there will be a problem with secondary reflow on the top side of the board. PCBs flex during wave soldering as they do during reflow if not supp
Electronics Forum | Thu Jun 25 10:32:51 EDT 1998 | Gary Simbulan
Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handboo
Electronics Forum | Wed Jun 24 16:30:37 EDT 1998 | Justin Medernach
Hi all, I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process terminolog
Electronics Forum | Wed Jun 24 20:06:42 EDT 1998 | Dave F
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach
| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te
Electronics Forum | Wed Jun 24 17:41:46 EDT 1998 | Wayne
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Wed Jun 17 17:09:36 EDT 1998 | Gary Rojo
| I am involved in the purchasing decision (Technical side) of which placement machine to buy. One of the criteria we need to specify is how many feeders, and what sizes. I have a provitional parts list of a job that we are most likly going to build.
Electronics Forum | Wed Jun 17 08:28:51 EDT 1998 | Steve Schrader
| I am involved in the purchasing decision (Technical side) of which placement machine to buy. One of the criteria we need to specify is how many feeders, and what sizes. I have a provitional parts list of a job that we are most likly going to build.