Electronics Forum | Thu Feb 15 15:23:12 EST 2007 | bvdb
The IP-1 vision error is" "Processing Error" er 401F 4003 which the FIP-I Operating Manual says the cause is "The actual number of leads on the part exceeds the number of leads in the Part Data". I have checked and re-checked the part data, lead
Electronics Forum | Wed Feb 28 12:34:21 EST 2007 | rob_thomas
Every component has a "how to order" paragraph in their data sheet with specific suffixes,letter/digit combinations that reflect each parameter of that part including packaging, lead finish etc. So if you order using the manufacturer p/n you are alm
Electronics Forum | Fri Mar 16 01:26:31 EDT 2007 | CHITRA K
Many thanks for your reply. We would like to clarify two things; 1. We have recently purchased a vision system with oblique viewing facility to rotate the camera with 40x magnification, which we find useful to inspect fine pitch components . 2. Wh
Electronics Forum | Thu Mar 29 08:46:23 EDT 2007 | realchunks
Well I DO KNOW! Hi aj, 100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After re
Electronics Forum | Wed Apr 18 09:16:51 EDT 2007 | Cecil
We currently have an assembly that we have to mask the surface of several (24)SMT components where thermal compound is applied at a latter operation. These component packages vary from BGA's to QFP's. After the thermal compound is applied the PWA is
Electronics Forum | Fri Jun 22 16:18:38 EDT 2007 | mika
Hi, I am interested of what the Fuji field engineers has to say about this? I trust You did not do all of this "replacement & calibration" by yourself? Is this happend randomly in a previuos known good pattern program, or just with a certain parts
Electronics Forum | Thu Jul 12 07:38:23 EDT 2007 | avalancher
Hey Sr, I agree that 130 is enough to pull a tiny little 0402, but I think that your forgetting response time. The machine has a small reservoir built in the system that keeps some moderate standing vacuum, however, when a part is picked, there
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
