Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Mon Aug 05 15:26:09 EDT 2002 | John Patricelli
I've attended the Advanced Programming Course and the Maintenance Course at their Rowley, MA site. I also talked to the trainer, Toby Upham, about some of the other training courses they provide. It sounds like the New User Training course covers m
Electronics Forum | Sun Aug 11 22:28:07 EDT 2002 | jersbo
a: charges are typically set by how many different part numbers you have(setup).. and how many placements there are(ie number of locations parts are to be placed) if there are 3 machines inline that does not matter.. its the amount of parts placed an
Electronics Forum | Mon Aug 19 16:57:38 EDT 2002 | dragonslayr
Individual process steps are approximately the same length of time for reworking a BGA. You seem to be comparing the use of the automated SMT line versus an off line rework station. Consider that the off line station is a complete paste print, pick
Electronics Forum | Tue Oct 01 16:19:35 EDT 2002 | dragonslayr
Hello all- I am am seeking information to the top 100 BGA grid patterns. I am planning to have a full sheet of stencil foil populated with these most common types. I will cut out the individual grid patterns and create my own mini stencils. In a 27
Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef
We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes
Electronics Forum | Fri Oct 25 12:23:49 EDT 2002 | yngwie
Hi Experts, I'm facing short problem with BGA at SRT rework in one particular BGA. It is BGA, with a metal piece at the center like a coin. The BGA is located in between two high profile press fit connectors and the short always observed at the si
Electronics Forum | Tue Feb 11 17:14:50 EST 2003 | Matherat
Traditional methods of hand assembly are as you described. For a company that is concentrating on the 1-5 or 5-50 quantities you've described, you need to look for ways to accomplish your task with speed, repeatablilty, quality and at a fair price. T
Electronics Forum | Thu Apr 03 09:08:50 EST 2003 | rdr
Thanks Scott,Iman, The problem has been isolated to detachment from package so I believe that there are no fabrication issues related to the Gold on the PCB. What is a Moyet analisys? where can I find more info? Dave, I am still waiting on Altera t
Electronics Forum | Thu Apr 03 11:17:17 EST 2003 | rdr
Well, first off now I'm just starting to believe that we are fracturing again. But here is some more input D1 ENIG? I would not have thought that they would be but as usual you are probably right. D2 Again I would have to agree about it should affe
