Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Thu Jan 24 10:28:06 EST 2008 | flipit
Anyone have any recent links to salary ranges for SMT Process Engineers and Micro Electronics Packaging Engineers.
Electronics Forum | Thu Jan 31 08:30:56 EST 2008 | ratsalad
What brand/model of machine are you talking about? What package style is the part?
Electronics Forum | Thu Feb 14 10:44:10 EST 2008 | jeffharley
We have several, do you need a specific drawing or the whole package?
Electronics Forum | Mon Aug 18 09:28:04 EDT 2008 | eyalg
The following standard is used to determine warpage: "High Temperature Package Warpage Measurement Methodology" JESD22B112
Electronics Forum | Wed Oct 01 07:54:25 EDT 2008 | davef
You might need to straighten the leads prior to soldering.
Electronics Forum | Thu Oct 02 17:26:41 EDT 2008 | omid_juve
Thanks a lot if anybody know any source that have this kind of equipment please tell me .
Electronics Forum | Thu Oct 02 17:55:16 EDT 2008 | davef
~le sigh~ makes a good point about forcing bent leads into the solder, letting the solder cool, and releasing the force on the lead. On the other hand, reforming leads of components prior to assembly is dangerous, also, because the "bending of a lead
Electronics Forum | Thu Oct 16 07:38:35 EDT 2008 | rway
There are seconds when it comes to components. Find out what her sources are and if she is purchasing from a reputable vendor. She may be doing what all purchasing agents do, and that is finding the best deal out there. Especially if her review de
Electronics Forum | Mon Mar 09 07:14:35 EDT 2009 | gregoryyork
wow enig is usually not associated with this failure
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