Electronics Forum | Wed Jul 26 07:40:37 EDT 2000 | JAX
gary, If you know who you are buying the parts from( who is your vendor), you can either log on to there web site and find the packaging specs or contact them and ask. All you need is the manufacturing number of the part, and your purchasing group
Electronics Forum | Thu Jun 15 08:10:14 EDT 2000 | Dave A
Gary, Have you looked at Cimetrix Inc.? They have several packages dedicated strictly to CIM. I think you will be happy with it. Website is www.cimetrix.com Check it out and let me know what you think. Thanks, Dave
Electronics Forum | Wed Jun 07 08:52:16 EDT 2000 | Dave F
Dreamerperson: Our Quality guy suggested the following: * ASTM D-775 and TAPPI T-802 * ASTM D-3332/Method B * ASTM D-880, D-4003 or TAPPI T-801 Ta
Electronics Forum | Tue Jun 06 05:26:04 EDT 2000 | Jacqueline Coia
Hi There, Could someone please point me in the right direction in the subject of baking 'metal' packaged BGAs before rework. What are recommended baking temp. & time. Much appreciated. Jack
Electronics Forum | Tue Jun 06 17:20:05 EDT 2000 | Travis Slaughter
There is no difference in 0402�s on the bottom side than 0603 0805 1206. They will not fall off or tombstone, unless they where before you put them in the oven.
Electronics Forum | Tue May 23 21:03:18 EDT 2000 | Dave F
David: Beyond the information on sealing components in the archives, look for information on protecting boards. Further, consider a dessicant cabinet, as an alternative. Sources are also in the archives. Good luck. Dave F
Electronics Forum | Fri Apr 28 03:26:23 EDT 2000 | Chris May
Have a chat to the guys at QUAD. I believe they can supply printer/placement/reflow equipment as a turn key package and also incorporate board handling conveyors, gates etc; Regards, Chris.
Electronics Forum | Fri Feb 25 16:10:11 EST 2000 | Dave F
Russ: You're correct, running second side SMDs on the wave without adhesives is more fun than a lot of people think. Ta. Dave F
Electronics Forum | Thu Feb 24 13:20:40 EST 2000 | Horace Johnson
What software package out there that can manage WIP. We are in the process of consolidating two of our SMT lines into three individual lines for equipment utilization. This will create lots of WIP and need a way to manage it. Any ideals
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
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