Electronics Forum | Mon Feb 02 09:05:36 EST 2004 | pjc
http://www.tessera.com/library.cfm http://www.tessera.com/technologies/technologies.cfm Tessera also has sheets on the construction of these advanced packages.
Electronics Forum | Wed Feb 11 08:04:16 EST 2004 | autissier
I'm looking for input from anyone who has experience assembling the LGA package on PCBs. Design, stencil opening, or other requirements are welcoming
Electronics Forum | Fri Mar 19 07:06:27 EST 2004 | george
Vijay: If you are still having difficulty or are frustrated with your yields try http://www.solder.net. They work on the most difficult packages and boards.
Electronics Forum | Mon Mar 08 15:59:51 EST 2004 | mrmaint
Looking for warranty information on BGA packages. Specificaly what type of warranty if any, after reballing and reinstalling the BGA. Does reflow more than 2 times void this. Thanks MrMaint
Electronics Forum | Thu Apr 01 12:44:06 EST 2004 | Chris Lampron
Laxman, JEDEC J-STD-033A has a bake time/temp table based on different package thicknes.
Electronics Forum | Tue May 04 13:11:17 EDT 2004 | Rob
Does any one can send me land pattern recommendation for package TSOP44 type II please. Rob
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
Electronics Forum | Wed Jul 07 18:36:17 EDT 2004 | russ
We place both of these packages on a regular basis and experience no issues. Just run 'em like any other BGA. Russ
Electronics Forum | Tue Jul 06 05:33:46 EDT 2004 | ANDREW
1)What is the MSD level for PCB? 2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assembled on the board.
Electronics Forum | Fri Jul 16 03:40:17 EDT 2004 | Rama
We are going to start producing product that require us to assemble Stacked BGAs. My question - how to rework this package, as the the process of either removing or re-placing them onto the PCB will the effect the BGA sitting on top of it. Pls help.
