Electronics Forum | Tue Nov 06 09:10:02 EST 2007 | ralphspm
What would be the best software packages available to produce assembly programs from basic gerber data?I'm using FUJI CP3 & IP1 M/C's with fujiflexa software.
Electronics Forum | Mon Nov 19 21:25:07 EST 2007 | davef
J Webster: Can you send / post pix of your cracked capacitors? What do you think about our assumptions? They are: * No flex in end-item use * Supplier has no defective packaging * No hand soldering of these parts * No impact or flex from ATE * No H2
Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
Hi there, kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Sun Nov 25 20:36:15 EST 2007 | shy
Hi Devaf, Sorry to make unclear statement earlier. I believe the issue that i'm trying to discuss is regarding the adhesive that place beneath (center) the component to prevent it from drop during wave soldering process. Normally the component pack
Electronics Forum | Mon Dec 03 02:44:27 EST 2007 | shy
Hi Loco, If i cover all the SMT component with peel off before reflow, it'll increasing downtime at my production site. To reduce the downtime, we had idea to add in the glue for component package 0805 and bigger.
Electronics Forum | Tue Jun 24 21:01:27 EDT 2008 | fowlerchang
Qulification the baking process of 70 degree and 24 hours below 10Pa. We have the experiment data which shows the weight of baked water from package with this condition is more than 125 degree at normal condition.
Electronics Forum | Wed Jun 25 08:06:04 EDT 2008 | davef
Questions are: * What does "weight of baked water from package with this condition [70 degree and 24 hours below 10Pa] is more than 125 degree at normal condition" mean? * What is "normal condition"?
Electronics Forum | Fri Jan 18 19:02:45 EST 2008 | arun2382
I agree, except you need to be careful with the depth of cut since it may affect the package internal connections (wirebonds) -A
Electronics Forum | Thu Jan 17 14:52:17 EST 2008 | gnath
All, Can someone help find a source for purchasing interleaving/packaging paper for Immersion Silver boards (sulfur free + ph neutral ..). Thank you!
Electronics Forum | Fri Feb 22 08:23:51 EST 2008 | aj
All, I understand that there is a requirement to upgrade the narrow view camera on the Fuji CP642 to place 0201 components - is this necessary ? Also, 1 - What tape package to they come in ? Can you use 0402 feeders? aj...
