Electronics Forum | Tue Dec 14 02:19:03 EST 2010 | sachu_70
With lower Humidity levels, we expose to greater risk towards ESD related failures seen on components. Pl. ensure to have your entire work area fully guarded against ESD and maintain proper material handling instructions across the entire flowline un
Electronics Forum | Fri Dec 17 20:47:51 EST 2010 | jlawson
Also take a look at vplan from Mentor graphics(Valor) this has very powerful CAD/CAM to centroid capability...can generate Centroid data from Gerber - creates packages , polarities and assigns Refdes with easy to use tool...
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Electronics Forum | Fri Jun 10 14:32:11 EDT 2011 | remullis
I'm seeing if anyone has a C5 with the offline software package. I am having problems configuring a zebra barcode printer.
Electronics Forum | Tue Jun 14 10:01:01 EDT 2011 | travishemen
.088" from the edge, running parallel to the V-score, 1812 package size. Kemet part number C1812C105K5RACTM. Thanks
Electronics Forum | Sun Jul 31 10:06:51 EDT 2011 | davef
Try the NASA Workmanship Standards Inspectors Pictorial Reference document: http://workmanship.nasa.gov/lib/insp/2%20books/frameset.html Look at Section 7.08 SURFACE MOUNT TECHNOLOGY (SMT) BUTT "I" LEADED PACKAGES
Electronics Forum | Thu Jul 07 08:39:39 EDT 2011 | ianjames
How to compensate the back pressure effect that affect the wire of SMT molded package? The wire looks like snake and we call-it snake wire. It only happen near the stitch.
Electronics Forum | Fri Jul 08 12:31:01 EDT 2011 | smtlogics
I am evaluating PACE IR300 rework system for micro BGA having size .85mm x 1.35mm. Is anyone out there has any experience of reworking this package size BGAs. Your comments will be appreciated.
Electronics Forum | Thu Jul 28 18:12:47 EDT 2011 | asksmt
Hi, what kind of issues i could get if the i do not provide heal properly in my footprint ? In my current design 0603 resistor package footprint heal is missing by 3 mils each side Please help
Electronics Forum | Fri Oct 28 13:27:58 EDT 2011 | kmakiya
Check to see if the mount precision is set to high in the package acceleration field. We set this to normal and the oscillation went away. I wonder if slowing down the x-axis would help.
