Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J
One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have
Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian
I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug
Electronics Forum | Sat Feb 26 20:44:46 EST 2005 | siverts
Some of the QFN's have/has? (sorry for the grammatics but I live in Sweden) a "ground pad" underneath the center of the body. Some of the manufactories have made a specification of how much solder fillet that needs to be covered on the center pad [f
Electronics Forum | Sat Dec 17 15:58:57 EST 2005 | Mika
We are also interested in this, but where can we find the dimensions? We have thouht about some kind of a guideline to simplify the way of how we do the "Matrix tray numbers" input to our fine pitch machine. We do a lot of prototype production and ev
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Tue Feb 07 05:40:16 EST 2006 | pavel_murtishev
Good day, J-STD-033A: 4.1.2.2 Moisture Sensitivity Levels 5-5a For moisture sensitivity Levels 5 and 5a with floor life exposure not greater than 8 hours, a minimum desiccating period of 10X the exposure time is required to dry the SMD packages en
Electronics Forum | Sat Mar 25 00:02:17 EST 2006 | rpowell
Hi everyone, I'm relatively new to SMT PCB design and am running into some frustration with the land pattern design of "standard" smt components in particular passive chip components. It seems each manufacturer (Yageo, Rohm, Panasonic) has their own
Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca
I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1
Electronics Forum | Mon Aug 28 13:14:49 EDT 2006 | SWAG
We just bought an Advantis w/flexjet head. Great machine. No problems with anything and Universal support is excellent as always. Prec-Pro dual lane feeders are the way to go. Also, I recommend buying the NPI module. This software allows you to
Electronics Forum | Sun Dec 24 15:30:07 EST 2006 | pima
hello Everybody I would like to ask you for advise. I'm fighting with correct placing one of capacitors in TNT-A package at CP-6 machine. Size of this component is: L=3,4 mm W=1,7 H=1,7 Its Tantalium with J-lead. I use for this component vision type