Electronics Forum | Tue Feb 23 04:54:54 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Thu May 12 10:49:27 EDT 2016 | Bill Albright
If an electronic component with a MSL rating of 1 is exposed to an moist environment greater than the 85% relative humidity to the point where the packaging is wet, what is the risk level of using the device in a lead-free soldering reflow process?
Electronics Forum | Wed Jul 06 06:17:11 EDT 2016 | pavel_murtishev
Dear members, Recently we have found that solder mask thickness variation could lead to solder balling under QFN packages for a high reliability device. Is there any industry proven method for solder mask thickness checking? Any equipment or any me
Electronics Forum | Thu Nov 03 01:14:12 EDT 2016 | soniyaphilip
I am not familiar with FUJI CP4-3 machine . This makes a together package FUJI IP3 . This equipment makes a different sub equipment . I think each onne is important for data manipulation. It control the real-time production data from the MCS controll
Electronics Forum | Fri Nov 25 20:47:54 EST 2016 | sarason
You are coming up against the no of tracks vs density problem. There are basically 2 solutions, more layers so you can get 1 track between each pin as it exits the structure from underneath the IC, say 3 rows of BGA is 2 layers, 5 rows is 4 layers et
Electronics Forum | Fri Jan 13 04:48:12 EST 2017 | mrpackethead
Hello, i'm very much in need of obtaining this software so i can create files to load on a Yamaha VY100. I've tryed several other software packages and none of create files that work. A couple appear to get very close, but still crash on import. If
Electronics Forum | Thu Mar 02 10:46:34 EST 2017 | Rob
Hi Rick, we have seen this issue before with small volume and prototype parts coming in from catalogue suppliers, where they are decanted from the original manufacturers packaging and sold in smaller batches. Also after going out for programming.
Electronics Forum | Tue Mar 14 12:22:20 EDT 2017 | pzappella
Hello, I was at a IMAPS conference last year 2016 and several presentations for QFN packages showed x ray images with high void levels of 30 to 50% with the best around 15% with solder paste. During the discussion it was mentioned that the auto in
Electronics Forum | Tue Apr 04 10:39:12 EDT 2017 | prdmm1
we have a My9 using 2.4.6B software. the auto teach for new components option is there when creating a new package. but when i select it, it wont work. does this mean i need a software upgrade or does this mean the auto teach was disabled? when i hit
Electronics Forum | Tue May 02 15:25:22 EDT 2017 | mrk
Hi, We have recently been tasked with producing a PCB assembly that requires a chip resistor to be stacked on top of a chip capacitor (both are 0603 package size). This becoming a more common practice, I was wondering if anyone has been successful i
