Electronics Forum | Mon Jun 04 20:55:55 EDT 2001 | craigj
Have been having problems with the above IC but dont know why. Our profile is well within the manufacuters recommendations. We are getting a higher than desired first off fail rate and are concerned. It is not possible to inspect the soldering as the
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Tue Jun 19 10:59:21 EDT 2001 | Gil Zweig
When x-ray inspecting BGA packages with metal heat spreaders tube voltages greater than those used for Plastic BGAs must be used. It must be recognized, however, that the tube votage required will depend on the particular sensitivity of the x-ray cam
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
Electronics Forum | Wed Aug 15 18:16:15 EDT 2001 | Shindler
Hi Larry- Be wary of which IR systems you use, dark IR (ERSA) maintains only the positive effects of infrared use in that this infrared medium wavelength has the optimal absorbtion/reflection ratio between light and dark colors. Therby, guaranteeing
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Mon Jul 23 13:26:23 EDT 2001 | Hussman
Yes, by the component is a start. There is also board cost, and process material costs, engineering costs if needed, pallet cost if needed, and packaging costs. Inspection and test are another part of the cost. Will you provide your own test-set?
