Electronics Forum: packaging (Page 191 of 288)

Re: Quad vrs. Mydata

Electronics Forum | Mon Nov 09 22:33:42 EST 1998 | Jim McCarten

I have had experience with both companies. If you are doing contract work and get you parts and boards in a box, the Mydata does a fine job of teaching a board on the machine. Quad's strengths are in their software and the ability to automatically

Re: BGA rework and reliability

Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark

| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew

Re: Cracking Capacitors

Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos

Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th

Re: Solder ball bridging under BGA

Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus

| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent

Re: Philips FCM

Electronics Forum | Mon Jul 27 23:20:14 EDT 1998 | Vincent Robert

| | I am considering of Philips FCM for the next production. | | But I have heard a rumour saying this machine is not capable for checking the lead polarity due to the laser scan system. | | i.e. SOT might be populated in wrong direction. | | Can som

Re: Component Feeder Sizes

Electronics Forum | Fri Jun 19 02:02:01 EDT 1998 | Scott McKee

| I am involved in the purchasing decision (Technical side) of which placement machine to buy. One of the criteria we need to specify is how many feeders, and what sizes. I have a provitional parts list of a job that we are most likly going to build.

Re: TCP solder / desolder / rework

Electronics Forum | Thu Jun 18 10:57:28 EDT 1998 | Mike Moninger

| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,

Re: CCGA

Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon

| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA

Re: CCGA

Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange

| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Mar 24 17:08:52 EST 1998 | Steve Gregory

David, There was a thread going on the IPC TechNet about exactly the same thing... The ratio that was posted is: Less than, or equal to 30-grams per square inch Which means if you weighed a part and it is 30-grams, you'll need .033" of surf


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