Electronics Forum | Fri Oct 08 07:26:22 EDT 2010 | walkbury
Yes... I can generally get away with it for all but the low profile stuff such as tssop packages. The plastic tubes are so shallow anyway that once you've used a scalpel to create a pick up window, you've virtually got no side-wall left. Anything b
Electronics Forum | Tue Oct 26 16:41:05 EDT 2010 | sai
I have been trying to get the profile right for this part(OMAP3503DCBC) , but still struggle. I'm using the Herller 1809 MKIII oven. I look at the profile recomended by TI and still issue with the solder ball collaps and wetting. My peak temp @256
Electronics Forum | Mon Jun 18 12:14:43 EDT 2012 | dyoungquist
We have a Heller 1707EXL oven. I am assuming the software package that came installed on the computer for the oven is very similar to what you have for your oven. One of the programs in that software package is "ovensetupwizard.exe" You need to
Electronics Forum | Fri Aug 10 18:06:52 EDT 2012 | mfergus
Anyone have experience printing solder paste for a Toshiba SSM3K15CT(TPL3) FET with CST3 package? Using 1 to 1 rectangular apertures with a 4 mil stencil and Alpha OM 338 #4 powder size lead free solder paste. Print head speed is 15 mm/sec and solven
Electronics Forum | Wed Nov 14 09:48:56 EST 2012 | rway
It depends on what type of packages you will be working with. Will you be working with BGA/LGA devices or QFP. For QFP, Pace is a really good system. I would recommend a power supply with 3 ports: iron, de-solder, and hot air. You can replace mos
Electronics Forum | Wed Nov 21 15:58:23 EST 2012 | rway
Before you go out and spend 60K on a rework system, you need to look at what technologies you are prototyping with. I'm speaking common-sense of course. A cheap rework system such as Pace MBT systems will allow you to rework most components. For m
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Fri Aug 26 19:59:02 EDT 2016 | mhanrahan
We've just purchased a CP45FV Neo to replace an ancient Panasonic line. First non-Panasonic placement equipment I've worked on, so learning as I go here. So far it's been pretty straightforward. However, we use some parts that come in QFN or LCC p
Electronics Forum | Thu May 04 10:10:03 EDT 2017 | rgduval
My machines do this kind of stuff all the time. Usually when I don't want them to! But, as long as you can control the z-height during plaacement, I don't see that it should be all that difficult to achieve....depending on package size, of course.
Electronics Forum | Tue Aug 01 11:23:56 EDT 2017 | OrHorti
We are using a custom made nozzle, designed for this particular LED. The dome of the LED is also custom made, the diameter of the lens at the base is 2.9mm while the substrate of the package is 3.3mm, so this gives about 0.2mm spacing between lens a