Electronics Forum: packaging (Page 96 of 288)

DPAK land pattern

Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef

In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t

PCB storage for lead Free

Electronics Forum | Tue Sep 16 20:41:41 EDT 2008 | davef

Q1. Can anyone tell me if there is a procedure for storing raw PCB's? A1. Yes, there are thousands of procedures for storing raw PCB. Why so many? Everyone writes their own procedure. Generally, they say: * Boards require individual separation and p

Re: Butt-joints

Electronics Forum | Thu Sep 14 13:34:43 EDT 2000 | Boca

Of course the others have great answers, try NOT to do it, for all of their reasons. However, had to do it in the past, OEM, custom chip, die wouldn't fit in a SM package, volume wouldn't support a second package type ...... and on and on. So we us

Re: LGA Stencil Spec

Electronics Forum | Sat Aug 05 09:06:40 EDT 2000 | Dave F

I'm confused ... Land Grid Array (LGA). An alternative to the BGA for device manufacturers is to package their devices without any terminations on the bottom. Although not technically accurate, the easiest way to envision an LGA device is to pictu

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer

Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu

Re: Training

Electronics Forum | Tue Dec 19 21:48:05 EST 2000 | Charles Harper

Yes,we have over two dozen courses covering all ranges of interests from fundamentals to all of the advanced high performance electronic packaging and circuit technologies.We provide these courses to a broad range of industry,government and educatio

Polarity of parts in packages

Electronics Forum | Thu Oct 28 20:31:52 EDT 1999 | JC Leigh

Hi all, Been thinking about this problem because it's costed us some errors before. For the same type of parts from different vendors, the polarity of parts in the taping may differ from vendor to vendor. (Actually, we find that parts from most ve

Re: Polarity of parts in packages

Electronics Forum | Fri Oct 29 18:24:46 EDT 1999 | B.Smith

JC, We 'had' this problem previously, but eliminated it for good by using the following: (1) Create a procedure for part orientation that follows IPC standards. Give a copy of this procedure to your receiving department, your buyers, as well as all

It's possible

Electronics Forum | Wed Nov 03 22:25:09 EST 1999 | Steve Evers

...Just not sure you'd want to pay for it just yet. NdYAG wavelength, slightly diffused beam, tightly moderated power and amplitude control. Add to that a laser safe enclosure that insists on watching your work through a dark green filtered window

Re: Ic's sesitive to moisture

Electronics Forum | Thu Sep 23 10:11:15 EDT 1999 | Earl Moon

| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci


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