Electronics Forum | Wed Apr 10 22:25:29 EDT 2002 | davef
BAKING MSD AT 5% You can bake at any RH% you�d like. The further you get from 5%, the longer it takes. Those guys in production are just bustin� ya. For background, look at: * http://www.seikausa.com/mcdrysmt.pdf * http://www.aecouncil.com/Papers
Electronics Forum | Wed May 08 11:07:54 EDT 2002 | Carol Stirling
We have a concern with moisture absorbtion/humidity effects on PWBs specifically used for automated SMT (including BGA). I'm sure there is a IPC spec on this and would appreciate the number - I've searched the IPC web-site -no results. Could you t
Electronics Forum | Wed Mar 05 10:59:04 EST 2003 | jfb2003
Currently, my company's applies a PCB bake (5 hours @ 125C) for all SMT PCB's prior to surface mount assembly. Many of us believe this is a non-value added activity, and have concluded it can be eliminated. With today's PCB process controls coupled
Electronics Forum | Fri Mar 21 11:10:24 EST 2003 | davef
There is no standard. If your boards solder well, they're good. Well soldered boards that have been stored a long time will have field life similar to well soldered boards that have not been stored a long time. The solderability of boards depends
Electronics Forum | Wed Aug 27 09:23:03 EDT 2003 | Darrow Gervais
I have an SMT application in which I would like to eliminate the soldermaks layer. I am working on a VERY tightly packed board so I cannot bury the traces and connected them to the pads with vias. I was thinking about selectively plating the expose
Electronics Forum | Tue Sep 09 15:32:24 EDT 2003 | mantis
We have also seen A similar issue were by the pad would completly come away from the bga land , when lightly scratched with your finger.These boards hadnt even been through our process yet and where fresh out of the pack.These issue was seen at incom
Electronics Forum | Mon Mar 08 14:39:54 EST 2004 | Gabriele
Have you considered those Tant Caps could be moisture Sensitive Components ? During last year, several Brand Suplliers classified their Tant Caps as Moisture Sensitive Level 2a (4 wks out of dry pack before reflow, see J-STD-033a) some even MSL:3
Electronics Forum | Sun Apr 18 07:01:10 EDT 2004 | Nick Prince
"Thanks for all your informative replies. I do know that Motorola is using a No Clean Eutectic Solder for their BGA's. We are in Aerospace and is using a Water Soluble Paste Flux." This statement is confusing me (not to difficult at my time of life)
Electronics Forum | Wed Sep 15 11:05:16 EDT 2004 | rlackey
Hi John, It depends on what equipment and resources you have at your disposal - if you have an antique wave with crap adjustment & hand sprayed flux, no debridging/air knife system on a tightly packed board with a multitude of fine pitch connectors
Electronics Forum | Mon Sep 20 21:37:14 EDT 2004 | Hayden
Hi folks, I currently use the supermole gold to do all my SMT relfow profiles. However, I've lost the charger for the supermole battery pack. If someone also use this tool and have their charger handly, would you please look at your charger and give
