Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills
Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said
Electronics Forum | Fri Oct 31 07:52:23 EDT 2008 | davef
For a better understanding of decoupling capacitors, look here: * http://en.wikipedia.org/wiki/Decoupling_capacitor * http://www.hottconsultants.com/techtips/decoupling.html * http://pcdandf.com/cms/content/view/3410/95/
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Thu Oct 30 15:36:18 EDT 2008 | grantp
Hi, Sounds like your engineer does not know what he's doing. We have developed and built hundreds of thousands of boards with normal square pads for 0402, and we just use a 5 thou stencil with 5% reduction and it works well. Decoupling? What is tha
Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788
Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e
Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
Electronics Forum | Mon May 09 09:23:45 EDT 2016 | markhoch
I agree with the previous two replies. This is a perfect design....if you're trying to create a graveyard full of tombstones.
Electronics Forum | Fri May 06 08:39:59 EDT 2016 | kahrpr
The first issue I see is that you have a high potential of the 402 tombstoning.
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
