Electronics Forum: pad contamination under kapton tape (Page 1 of 3)

COB pad contamination from kapton tape adhesive

Electronics Forum | Tue Jul 10 03:51:49 EDT 2007 | vangogh

Hi All, We are producing PCBA with COB process. We are using kapton tape to protect the COB pads from solder splashes/stains. Questions: 1) Is kapton tape an industry accepted way of protecting gold pads from solder splashes? 2) What are the chance

COB pad contamination from kapton tape adhesive

Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef

Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc

PCB pad contamination

Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh

Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o

How to prevent COB pad free from contamination

Electronics Forum | Thu Mar 20 08:45:02 EDT 2008 | davef

Common methods use to protect pads from solder splatter are: * No residue Kapton tape * Nonionic solder mask

Re: ICT sites under BGAs

Electronics Forum | Wed Aug 09 22:11:46 EDT 2000 | Dave F

Mark: The best routing of test vias for BGAs is to keep them far away from the device. We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine. Yes, on the top-side

Incomplete reflow

Electronics Forum | Mon Apr 07 15:14:41 EDT 2014 | garym4569

I drilled a small hole from the other side in order to get my thermocouple under the inductor pad. I did not have anything on hand to fill the hole, so I covered with kapton tape the best I could. I suspect that is why it looks like it should work.

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 17:58:01 EDT 1999 | Boca

| My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side it wo

Re: Gold Finger Cleaning

Electronics Forum | Fri Nov 13 23:33:33 EST 1998 | Kallol Chakraborty

| | | I believe that gold fingers on my circuit boards are being | | | contaminated and need to clean them with some chemical | | | solution. Any recommendations. | | | | | Chuck: What is the type and source of your contamination? Dave F | | We a

Voids problem in Lead free process

Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David

Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b

Re: Wave solder edge covers

Electronics Forum | Thu Jul 01 14:47:10 EDT 1999 | Tony

| | | My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side

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