Electronics Forum: pad definition (Page 1 of 13)

via under a smd pad ?

Electronics Forum | Wed Nov 14 13:05:40 EST 2007 | rgduval

I had one project with micro-vias in 0805 and larger pads, with no issues. But my most recent project had vias that were larger than the 0402 pads that the via was in. To the point that for a number of the lands, there was no visible pads (a couple

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:00:16 EDT 2005 | russ

Bad cleaning practice is suspect. It is believed that W.S. flux was used to solder adjacent components and then hand cleaned. This is not definite but it is pretty certain.

SMT solder pad design for hand soldering

Electronics Forum | Sat Apr 19 12:00:07 EDT 2003 | modeltech

I am completely new to SMT design and for my next project I plan to use SMT for the first time. Since production volumes of the PCB's will be low, hand soldering is definitely an option, and will be necessary for my prototype PCB assembly. My proble

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:08 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:40 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej

Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice

I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work

BGA Assembly

Electronics Forum | Mon Oct 21 19:17:23 EDT 2013 | hegemon

The first picture shows an issue. Note that the vias adjacent to the interior rows are filled with solder. At the outside rows this is not evident. What you might have are interior spheres that are smaller in volume than the rows on the outide, si

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ

Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask

Fuji IP 2 part data issue

Electronics Forum | Thu May 10 02:58:00 EDT 2018 | robl

Hi Dex, We're going back a few decades here, but... 1) can you treat it as 4 large leads - one rectangular block per side? 2) Is it failing on the coplanarity check set up or the basic vision? if Coplanarity, can you skip that check? 3) are you us

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