Electronics Forum: pad design (Page 1 of 121)

0306 pad design

Electronics Forum | Fri Dec 20 09:01:27 EST 2002 | russ

Greetings, Does anybody out there have any experience with 0306 capacitors (not 0603). I am trying to find a pad design for this component. I have searched the archives to no avail. The component is .06 long by .03 wide with .007" solder terminat

BGA pad design

Electronics Forum | Wed Jan 27 04:01:46 EST 2016 | slouis2014

Thanks alot for the info

BGA pad design

Electronics Forum | Fri Nov 27 00:36:02 EST 2015 | slouis2014

I just encountered a BGA design were in, underneath the BGA is a silkscreen that covered the entire bottom of the component except for the copper pads. Can you give any information and advice for this type of design.

0306 pad design

Electronics Forum | Fri Dec 20 12:12:12 EST 2002 | russ

Thanks Dave, I was looking in the Murata data base and couldn't even find the part (Even though they are the ones making it)let alone the pad dims. This part looks like it could be fun anyway. Russ

BGA pad design

Electronics Forum | Mon Nov 30 08:39:05 EST 2015 | spoiltforchoice

http://blog.screamingcircuits.com/2010/09/smd-vs-nsmd.html such as this? Which handily also tells you what you might want to google.

BGA pad design

Electronics Forum | Wed Dec 02 20:41:13 EST 2015 | slouis2014

Thanks for the link. Their is a white silkscreen underneath the BGA instead of a green soldermask. Attached is a picture of the BGA. Does these affect the solderability for the component.

BGA pad design

Electronics Forum | Fri Dec 04 23:15:45 EST 2015 | mac5

You say that there is no green solder mask around the lands of the BGA only silk screen. If that is the case I would be concerned about the solderabilty of the component if the silk screen gets onto the pads. The application of solder mask is much mo

0306 pad design

Electronics Forum | Fri Dec 20 10:13:38 EST 2002 | davef

The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. So, a 1210 chip size has a lower inductance than a 1206 chip. Check with your supplier for recomm

BGA pad design

Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk

In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t

Heat sinks re:reflow pad design

Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc

The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper

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