Electronics Forum | Tue Apr 13 08:19:52 EDT 2004 | arcandspark
The PCB's we are seeing the voids on are made of some material called Thermount, not FR4. The pads are very easily pulled off if any touch up or rework is done. The voids I am seeing are (hugh) 50% to 75% of the Solder Ball volume. The last new batch
Electronics Forum | Fri Jun 11 08:38:55 EDT 2004 | davef
We figured you were going to say that. Pay me now, or pay me later, you call it. As an alternative: * Cover the backside of the via with masking tape that will take soldering temperature, like Kapon, or a temporary solder mask * Enlarge the apertur
Electronics Forum | Mon Jun 14 11:44:23 EDT 2004 | Dreamsniper
I have boards with bad HASL application. First they're not even. Second some pad edges have no HASL and still remains bare copper. What's the maximum and minimum HASL thickness required for a good solderability. My boards are about 6 weeks old, I kno
Electronics Forum | Tue Aug 31 20:40:43 EDT 2004 | davef
Please excuse us if we seem dense, but we're stuggling to understand your problem. Are you seeking a supplier for pads [like those used to repair boards] that you can epoxy to your board? If so look here: http://www.circuittechctr.com/products/cond
Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef
Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati
Electronics Forum | Wed Oct 20 06:23:54 EDT 2004 | C Lampron
Hi Matt, Sounds like the HASL may be to thin on some pads and you're getting copper migration. If this is the case, and the solder paste is printing, I would asume you would see some solder balls under the BGA at X-Ray or incosistancies in ball size
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Fri Jan 14 11:16:45 EST 2005 | Dan Gosselin
I have heard of people using a round pad or Home plate design to decrease the incidence of tombstoning on 0402's Anyone have any practical experience on this or is everyone just using the IPC 782 recommended land pattern (28mil x 33mil rectangle pad
Electronics Forum | Fri Mar 04 11:30:46 EST 2005 | Steve
Is anybody using via-in-pad under a BGA successfully? Is this a specialized capability, or do most board houses have the capability to do micro-via's? How small does the via need to be in order to avoid solder wicking? I understand that in order for
Electronics Forum | Thu Apr 28 12:00:15 EDT 2005 | pr
You might try..... http://www.wpsales.com/ or SMT research They sell aftermarket nozzles etc. and if you show them a market for these Vac. pads I bet they would start carrying them (they may have them already). I'm sure there are others out there b
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