Electronics Forum | Mon Feb 11 13:07:30 EST 2013 | deanm
You want your machine to spot the fiducials automatically. A 40mil round copper pad is the absolute minimum fiducial to use, but we found in practice that our Quad equipment won't spot them reliably. I am now using a 60mil round fiducial and it picks
Electronics Forum | Tue Apr 15 15:12:50 EDT 2014 | bradlevy
Thanks Bob. I just didn't have enough experience with production SMT (vs hand-soldered prototypes) to know how finicky some things like this are. I've tried to do a lot of reading, but I haven't seen much that talks about things like this. I also hav
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk
In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t
Electronics Forum | Mon Jul 24 22:50:43 EDT 2017 | dawson
In fact, we can solve this problem easily. AOI only check whether the IC is soldered well. But we can ask our technician to make a test first to control the reflowing temperature and time. 1. using tool to test the temperature between the bottom IC
Electronics Forum | Thu Sep 26 11:53:40 EDT 2019 | scotceltic
Experiencing some solder balls on an SSO-36 package. Things I am planning on checking are as follows: (not necesarilly in this order) I am just looking for a sanity check to see if you would try other things to help ? 1) Reflow profile. I have he
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Wed Oct 23 02:45:17 EDT 2019 | maxwilko
Hello there, My 'MyChronic MyData My500 Solder Jet printer' keeps having the same issue and I am unable to solve the issue. Suction flow too low: Check filter box and suction holes are clear. This problem would usually be solved by a new filter bo
Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020
Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay
Electronics Forum | Thu Aug 13 16:57:32 EDT 2020 | rgduval
Is that no solder on the left hand pins in the picture? If so, it could be a directional thing. Have you tried turning the board 90º or 180º from the current direction of travel? Not a huge fan of wave solder for SMT components personally, though,
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