5546 pads results

Electronics Forum: pads (Page 186 of 555)

Voiding in CSP Ground pad

Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave

Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are

Plated through via's in pads.

Electronics Forum | Wed Feb 05 10:31:38 EST 2003 | bpan

Hello Everyone, Is anyone out there building smt boards that have plated through vias directly located through the pads. We are seeing some of these designs and the soldering is very poor because the solder is flowing through the via. We think that w

TOMBSTONE DEFECTS

Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto

Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v

TOMBSTONE DEFECTS

Electronics Forum | Tue Mar 18 16:41:04 EST 2003 | russ

Here is what I have been finding lately. We switched to a 22mil square pad on 40 mil centers (from the IPC "75/25"). ALL OF OUR TOMBSTONES HAVE GONE AWAY! (at least for now) we did not change profiles, paste, or any other parameter. Obviously placem

SMT process Blowhole/ Pinhole

Electronics Forum | Sat Mar 29 01:59:09 EST 2003 | iman

Yep, only the MLF have this blowhole/pinhole issue. Other components like SOT(transistor), CAP, RES are hey-o-kie. Btw, MLF = micro lead frame (IC/LGA) package. looks like a BGA without the solder balls. has direct attachment to the PCB ENIG pads wi

Sn plated

Electronics Forum | Wed Apr 16 21:00:50 EDT 2003 | yukim

Hi Dave, thanks! The peak temp on the terminal device is about 210C. Some more questions: The soldering part of the terminal is about the same size as the PCB pad. We observe a lot of voids when we remove the terminal device, whice can be removed v

Skewed transistors

Electronics Forum | Fri Apr 18 11:12:37 EDT 2003 | tsongshe

Thanks Dave.F. I 've carefully read what you recommended,but still can't get the answer.it's two different suppliers with diffrent pad patterns of each components.one of them can work well,while the other cant do.I think it must has something to do w

CLEANING OXIDIZATION OFF OF WHITE TIN PADS

Electronics Forum | Wed Jul 23 08:37:02 EDT 2003 | davef

Your fabricator should be able to re-apply the imm tin very easily. Actually, if we had boards like you describe [and we were sure we didn't mess them up], we'd be be making strong implications that our fab would need to make this right. Don't pin

Immersion Tin Tarnish

Electronics Forum | Fri Aug 08 06:44:33 EDT 2003 | Matt Kehoe

Emergency!!! We have a small run (5) of very dense boards that have an immersion tin finish. They were built in April/May and have a heavy tarnish appearance on them, smd pads and through holes. We are being asked to apply ssd to the surface mount pa

Black pad defect on gold plated boards

Electronics Forum | Thu Aug 21 22:47:39 EDT 2003 | adlsmt

Well after reading all kinds of stuff about this I still question if it is my current problem BUT, how common is this??? I dont want to be afraid of the boogie man but it seems like a lot of folks are having problems with black pad. I have used imers

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