Electronics Forum | Mon Apr 22 18:45:07 EDT 2002 | Steve Townsend
Chances are your profile is fine. There is probably too much paste on the descrete pads. Consider reducing the aperture size of the stencil. Good luck.
Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan
Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s
Electronics Forum | Wed May 08 08:26:31 EDT 2002 | mkkrishnakumar
dear sir, I am the regular viewer of smtnet.com, Could you tell me what factor effects the thickness of the solder paste on the smt pad. regards, m.k.krishnakumar
Electronics Forum | Fri May 10 14:55:59 EDT 2002 | xrayhipp
Pete, thanks for the input. These are microvias and dont go through the pcb -- they are laser cut to various depths into the board and are .006" dia. on gold plated pads. Paul.
Electronics Forum | Fri May 10 17:42:55 EDT 2002 | davef
I don't know �solder ballooning� from a shoebox. So, rather than let this degrade solely into a rant about the evils of via in pad, please get me up-to-speed in jargon.
Electronics Forum | Wed May 22 12:32:49 EDT 2002 | pwrgroup
which stencil vendor can deliver aspect ratio and area ratio and the statistical information to the user?It's difficult if the pad is modified.
Electronics Forum | Tue May 28 08:31:49 EDT 2002 | Hussman69
Hello, I know I will probably get a dozen "check the archives" answers, but what the heck. What is YOUR typical polarity mark for SMT devices? Do you use silk screen or cut a corner off a pad? Let me know and thanks.
Electronics Forum | Thu May 30 07:13:46 EDT 2002 | matherat
Ben, I am not sure about diamond shaped pads but if you are just getting into BGA you need to know about SIPAD ssd. http://www.sipad.com mkehoe
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
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