Electronics Forum | Thu Feb 13 09:34:33 EST 2003 | genny
Did it take you to the magazine website? Just scroll down to where it says magazine on the left side, choose past issues and pick January. I think it was the featured article. Or try this to go right to that article. http://www.circuitsassembly.com
Electronics Forum | Tue Mar 11 13:50:23 EST 2003 | MA/NY DDave
Hi David F, You are GREAT!! You must have read my mind by posting this notice so our intial responder can tune in if she so wishes. YiEng, MA/NY DDave
Electronics Forum | Mon Mar 17 15:51:35 EST 2003 | MA/NY DDave
Hi A GREAT come back!! After a Wait to see "Show and Tell" To change the topic you launched a little. Who has or has had, this ENIG problem??? A simple yes or no with some detail. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 07:26:22 EST 2003 | davef
Jodi We too have had little success with the approach described in the referenced paper. What method do you use?
Electronics Forum | Wed Feb 26 15:27:21 EST 2003 | robert valles
Sounds like someone before you was dealing with tombstoning components. We have had greater success with triangular paeratures for 0603 and 0402 footprints. Granted the pad will not be wetted completly but IPC requirements are maintained.
Electronics Forum | Sat Mar 15 00:52:18 EST 2003 | Grant
Hi, We had tomb-stoning on a product, and it was quite severe. We eliminated it by reducing the amount of solder paste on the small passible component pads. We used a 5 thou stencil, with 20% reduction, and it eliminated the problem. Regards, Gra
Electronics Forum | Thu Mar 20 14:01:34 EST 2003 | MA/NY DDave
Hi I understand that more circular or rounded pads also reduce the effect. I love it when many independent variables can alter the outcome. YiEng, MA/NY DDave
Electronics Forum | Wed Apr 09 09:44:12 EDT 2003 | iman
yes, we r profiling direct thermocouple attachment to the LGA pads. based on direct experience of yourself or others, what paste (brand/type3?/type4?/alloy?/flux%?) gives the optimal repeatable characteristic-patterns to minimize this defect?
Electronics Forum | Thu Apr 10 12:49:08 EDT 2003 | Giuliano
I am using the old Tango for DOS to create an board with a 1mm BGA chip. How to define clearance around the surface pads?
Electronics Forum | Thu Apr 17 10:25:42 EDT 2003 | davef
You'd think 219*C should be warm enough, but we'd go higher just to get the part to stick. What is: * LED terminations material? * Alloy and flux type of your solder paste? Is you solder sticking to the pad and not to the component? Or what?
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