Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Fri May 26 05:49:09 EDT 2000 | Richard Wilders
1.67. A lower accuracy will result in many off-pad flipchips; this means a lot of displacements. And there is no chance at all the flipchip will self-center back to the correct placement spot. I think you'll have to evaluate machinery that is capabl
Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall
Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend
Electronics Forum | Wed May 10 22:53:18 EDT 2000 | Tan Kheng Beng
The Cpk collected by placement on glass boards and calibration has been done. All has been fine until we actually try on actual boards with printing. We have problems like insufficient solder due to closed aperture, improper flow of solder on the pad
Electronics Forum | Wed May 03 20:19:31 EDT 2000 | Dave F
Sal: Sorry, sometimes (more often than I�d like to admit) I�m a bit dense. But first � Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and is applied inaccurately to metallurgical effects, like diff
Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB
Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good
Electronics Forum | Fri Apr 21 12:43:51 EDT 2000 | David
We are going to hand place through hole connectors by screening them top side in a double sided reflow board. I saw this done before sucessfully on a daily basis but is there anyone with a paper or specs as to what aperture size, any special pad cons
Electronics Forum | Thu Apr 13 10:45:49 EDT 2000 | Jacqueline Coia
Hi there, Has anyone got any 'positive' thoughts and advice on wavesoldering mini-melf components on solder side of PCB. So far results have been crap, in some cases both pads completely skipped. Is this type of problem generic with mini-melfs or mor
Electronics Forum | Thu Apr 06 08:31:13 EDT 2000 | D Scott
Angela Do you see this problem on other .5mm pitch devices or is it only on the QFP? Check placement height, too low or to high can cause you problems Pad co-planarity, are your boards HASL? Is your board sagging during placement(board supports) An
Electronics Forum | Sat Mar 25 12:13:13 EST 2000 | JAX
Robert, Have you checked for any form of contamination that might cause the solder not to adhere to the balls? From the pictures you have on the net it appears that you have too much solder on the pads. What thickness is your stencil? If it is to sp
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