Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Tue Jan 04 11:25:34 EST 2000 | Brian E. Steelglove
John, I work for Panasonic Create and I just got back from Japan where we sat through a presentation on pad layout and stencil layout on the 0201. Please give me your fax number and I will send it right over. Sorry I do not have it on disk. Bria
Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Fri Dec 17 15:11:34 EST 1999 | Alvin Kevichusa
Let's look at it this way... Imagine a multileaded component sitting on a flat surface. If all the leads touch the flat surface, they are all in the same plane (that of the flat surface) and are coplanar. Coplanarity is desirable because if a lead is
Electronics Forum | Fri Nov 19 22:00:44 EST 1999 | park kyung sam
Hello. smtguys Is there any body who has or know the in -line machine inspecting the solder paste after printing . what i only know is the centry 2000 made by the CYBER OPTICS. anything else ? for inspecting total pad on b'd. and i want to know th
Electronics Forum | Thu Nov 11 05:30:09 EST 1999 | Wolfgang Busko
For me it sounds like to much paste. If it worked in former runs with the same design and stencil look for changes in your printing process, check the volume and shape of your deposit. Redesigning pads and playing with aperture size allowing for mor
Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F
Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w
Electronics Forum | Thu Oct 28 20:45:38 EDT 1999 | chris
Hi Dave, We suspect that the organic FM causes the non-wetting problem. FTIR analysis confirm that the FM is a flux residue. Dave we only used FTIR to detect organic contaminants, we also used SEM/EDX to determined the elemental composition of the
Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F
Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in
Electronics Forum | Thu Oct 14 11:28:38 EDT 1999 | Bryan
We recently started designing boards using 0402's. The geometry was built using IPC specs but our contract manufacturer is having a yield problem. Approx. 20% of the 0402's are tombstoning. He claims the pads should be closer together; .4 mm between
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