Electronics Forum: pads (Page 361 of 555)

Re: Gold boards OK with SMT?

Electronics Forum | Fri Aug 07 07:52:15 EDT 1998 | Earl Moon

| | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not e

Re: Use of solder paste for leaded thru hole parts????

Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon

| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri

Re: Solder Joint Problem

Electronics Forum | Thu Jun 25 14:33:51 EDT 1998 | Chry

| Hi there Chris! | Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the location

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory

Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W

MELF component short togehter

Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef

Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki

gold wire bonding

Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris

I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu

AIM SN100C Solder paste

Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower

Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently

Lead-Free BGA Rework

Electronics Forum | Tue Jun 26 15:28:01 EDT 2007 | hegemon

There are a lot of variables in BGA rework in general, and the switch to lead free has only magnified some of the sore spots. Perhaps with a little bit more information someone here can be of help. What is the size and thickness of the PCB? What

Board Fiducials

Electronics Forum | Thu May 29 12:06:25 EDT 2008 | bsumfg

This thread is a pleading for all those PCB Design experts. A good design person with experience will design for manufacturing as well as to please the customer. Actually that goes hand-in-hand. If a board is designed well from a manufacturing standp

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro


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