5546 pads results

Electronics Forum: pads (Page 421 of 555)

Selective Solder Nozzle Life

Electronics Forum | Mon May 15 18:31:28 EDT 2023 | daniel_stanphill

I have found Superior No. 75 to be an absolute miracle worker when it comes to nozzle maintenance. I let our worst nozzles soak in that over the weekend and then the majority of the dross would literally flake off with light pressure from a pick/scre

Glued component location accuracy after reflow

Electronics Forum | Fri Jul 28 11:12:18 EDT 2023 | shrikant_borkar

Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with th

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 01:29:49 EDT 2023 | calebcsmt

I have noticed on a recent project, the QFN and SOP solder deposits do not seem very uniform and have been leaving little balls, whiskers and icicles of solder paste coming from some pads which leads to bridges. https://imgur.com/a/lqw5RF1 I have u

Improve quality with stencil design for inductor

Electronics Forum | Wed Oct 11 13:40:20 EDT 2023 | proceng1

Agreed. Your "leads" are fairly small compared to the PAD area, so you leave your part lots of room to "stretch it's legs". One thing that I have trouble communicating to my operators is that placement does not have to be perfect, and neither does t

Pasteprinter | unffilled Pads

Electronics Forum | Fri Oct 13 10:44:03 EDT 2023 | yannick_herzog

Hello, thank you for your responses. Some time has passed since then. Unfortunately, we have been facing the issue of incomplete filling in the production when it comes to large openings in the template. This phenomenon occurs in both directions. T

Pasteprinter | unffilled Pads

Electronics Forum | Mon Oct 16 16:30:27 EDT 2023 | yannick_herzog

@MagyarT the error occurred across multiple PCBs throughout the entire job. So, for example, the issue isn't limited to just the first printed one but spans the entire duration. At what dimensions would you recommend a division? The apertures on the

Problem with LGA bridging

Electronics Forum | Thu Apr 18 17:47:42 EDT 2024 | dwl

Is your stencil worn out? If your once flat stencil is now wavey, you will be depositing more paste. Ideally, you'll have historic SPI data to compare known good volumes from past prints to the current. Another possibility is moisture. Bake your boa

Re: Off Pad Printing - an update...big money ?

Electronics Forum | Wed Jun 30 22:00:29 EDT 1999 | Earl Moon

| | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, b