Electronics Forum: pads (Page 46 of 555)

Black Pad

Electronics Forum | Wed Oct 09 12:29:14 EDT 2002 | ppcbs

We have been encountering black pad contamination on gold plated boards mainly affecting BGA components during assembly. This problem has been noticed with many of our customers that are using an array of fab vendors. Does anyone have a solution fo

BGA attach eval.

Electronics Forum | Thu Apr 03 09:48:31 EST 2003 | davef

R1: Contacting Altera to find out if the BGA pads are gold. D1: Bet money the pads were ENIG. R2: Contacting Altera to find out if they use abrasives. D2: If abrasives were the problem, you�d see it in many pads, especially those close to the probl

Tombstone defect

Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef

If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that

CLEANING OXIDIZATION OFF OF WHITE TIN PADS

Electronics Forum | Thu Jul 17 15:23:23 EDT 2003 | James

It is really hard to tell what it is. It just looks like parts of the pad did not solder and you can see where the solder would even go around the pad leaving voids.

Bga pad remaning solder

Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee

Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank

Connector SMT assembly pads.

Electronics Forum | Mon Aug 30 02:23:35 EDT 2004 | Tommy.E

I have different connectors for volume productions. But I don't have pick and place pads for SMD assembly. Does anybody know a supplier for connector pads?

PBGA vias throwing solder balls

Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef

Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.

Open BGA joint

Electronics Forum | Wed Sep 15 23:00:36 EDT 2004 | pdeuel

if opens in same aria check for mask to via coverage for that pad. We had vias pulling solder from pad. We did not have totally opens but capalry from via was as strong as capalry to ball / pad creating small joint aria.

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 10:23:48 EDT 2004 | mrmaint

Matt, are there any discoloration of the pads on the raw boards. i have seen what we refer to as gray pads. Ran into this in the past and it turned out to be a problem at the board house with one of their dipping tanks. The proper levels for the proc

pad board separation

Electronics Forum | Fri Mar 24 08:32:17 EST 2006 | davef

Lifted pads are almost always caused by pad to substrate adhesion likely degraded significantly after too much heat. Poorly trained operators armed with soldering irons can do this expertly.


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