Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Sat Aug 22 10:25:11 EDT 1998 | Ben Salisbury
| We are using PCBs of CEM3 Material with bare copper fiducials. The whole | board is of bare copper with a lacquer coating (Coats brother S2974). | The fiducials are of 1 mm diameter bare copper. we use Panasert MV2F as | well as Fuji CP4-3. In bo
Electronics Forum | Sat Aug 22 17:01:31 EDT 1998 | Earl Moon
| | | Board shops and us, the user, have a lot on our hands. As far as getting traces - this is done using an etch resist before solder mask and the HASL processes are performed. | So when in the process is HASL performed?? | | | With tin/lead pla
Electronics Forum | Mon Aug 24 07:12:44 EDT 1998 | Tryin'
What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." | | | Board shops and us, the user, have a lot on our hands. As far as getting traces - this is done using an etch re
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Mon Aug 10 11:28:19 EDT 1998 | Justin Medernach
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Thu Aug 06 13:18:30 EDT 1998 | Bob Willis
| | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not e
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis
You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h
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