5546 pads results

Electronics Forum: pads (Page 61 of 555)

Pad dissolution on Thick PCB's

Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk

Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector

EL Cap _ Missing & Shifted out of the Copper Pad

Electronics Forum | Fri Jul 21 10:10:43 EDT 2006 | russ

these components generally have flattened through hole leads that have been formed for SMT, I have found that they do not sit well on PCBs. They rock, the leads are sometimes angled, etc.... In addition to Robs good advice you may want to just be sur

pcb smt pad replacements

Electronics Forum | Wed Oct 18 07:51:14 EDT 2006 | davef

Look here: http://www.circuittechctr.com/ As a low cost approach, use copper foil purchased from a stained glass window hobbyist shop. Cut foil pieces to size with a sharp knife. Epoxy the pieces in place of the damaged pads. Tin and then solder th

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:14:33 EST 2006 | darby

Maybe ask your customer where they got this idea from? It is possible they may have even got this idea from some white paper or article where they are trying to explain something else and show drawings with no solder between the pad and lead. It may

PCB finish for compression mount connectors (LGA's)

Electronics Forum | Tue Dec 19 21:23:39 EST 2006 | davef

We'd suggest using your connector supplier recommendations. Some use: * Pad Plating: 20-30 uin Au over 50 uin Ni (You might get away with less gold) * In-Pad Vias: less than half the diameter of the button (for contact-only configurations) * PCB/C

QFNs (LCCs)

Electronics Forum | Fri Dec 22 09:56:59 EST 2006 | wrongway

we just started placing these types of parts our first bacth of boards ran just fine no bridges no plscment problems the second run we had bridges on all most every one 100 piece build we found the first batch had solder mask between the pads the s

Stencil design

Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS

Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil

Stencil design

Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67

Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like

BGA via in pad

Electronics Forum | Fri Mar 16 17:15:51 EDT 2007 | davef

Ask the board fabricator to: * Fill the vias with resin. * Then metalize and copper plate the filled via along with the pad. * Then plate with solderability protection. This results in what appears to be a solid pad. For more, look here: http://www

BGA via in pad

Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W

Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi