Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Wed Jan 11 13:40:11 EST 2006 | muse95
We aren't using it - we are using Immersion Ag. I haven't seen Pd very commonly available from any of the vendors we use, so it would probably be priced at a premium.
Electronics Forum | Wed Jan 11 15:01:40 EST 2006 | Amol Kane
we have shortlisted Immersion Ag and Sn.....do you have any special storage conditions in yr facility for Immersion Ag boards?
Electronics Forum | Thu Jan 12 15:36:42 EST 2006 | amol_kane
do you have sulpher papers in the packaging? i thought they had to be stored in a controlled humidity environment. also, if i may ask, what is the mean time between receiving a bare board and reflow? Thanks in advance, Amol
Electronics Forum | Tue May 23 09:01:48 EDT 2006 | russ
Seems as though the problem is with PCB and not component? "Solder does not wet to pads, wets to component" What is your board finish? Russ
Electronics Forum | Tue May 23 09:27:37 EDT 2006 | Steve
Sorry I misled you. The PCB pads are wetting, but there is no fillet being formed. After reflow, it looks as though no paste was put down on the pads; however the paste print is fine. All other components solder real nice, it's only the Pd-Ag parts t
Electronics Forum | Thu May 25 09:09:43 EDT 2006 | cobar
Had the same problem with a batch of 0603`s nfrom Vishay. They eventually replaced the components after I proved that the problem was with the component.
Electronics Forum | Thu May 25 09:14:04 EDT 2006 | cobar
Print a number of pads of the 0603 on to a ceramic substrate. Then place the 0603 on the paste on the ceramic and refow. If the paste shows no wetting onto the component it will prove that there is a problem with the components solderability.
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Mon Feb 18 07:57:38 EST 2008 | davef
Silver palladium is intended for adhesive applications. You need components with a nickel barrier. While you're waiting for others to reply, search the fine SMTnet Archives [ar and pd] to find postings like http://www.smtnet.com/forums/Index.cfm?CFAp
.gif)
