Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.
| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack
Electronics Forum | Thu May 06 01:37:56 EDT 1999 | Kallol Chakraborty
| I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | PROBLEMS | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometimes are o
Electronics Forum | Wed Mar 18 22:53:53 EST 1998 | Scott McKee
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef
Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl
Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef
it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Wed Nov 02 21:50:23 EST 2005 | KEN
I beta tested these 6 months before general availability. These devices worked well in some situations and mrginally in others. Migrating to Gel may depend on what your current issues are with your current tooling solutions. Generally speaking it w
Electronics Forum | Mon Feb 27 13:02:13 EST 2006 | masrimhd
Hi, Thank you for your answers. But I want to explain some points on which I would appreciate any comment: * Having calibrated the process, we intend to carry out the ROSE test just on SAMPLES of the finished boards. Lets say one every hour. I exp
