Electronics Forum | Wed Mar 27 12:37:12 EST 2002 | jax
Barry, If you are looking to set up a documented process with set parameters you might think about performing a DOE based on the parameters you can control or change. With any measurement device you should be able to log the info gathered so you ca
Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Thu Aug 12 05:06:12 EDT 1999 | FMung
Hello, Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... B.Regards, Felix
Electronics Forum | Fri Dec 14 03:49:19 EST 2007 | cobrasv
Friends, Need some help here. Can anyone gimme any info about single line model RLC parameters of an RJ45 connector.
Electronics Forum | Fri Jan 20 20:57:26 EST 2023 | hi_fonsi
We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thic
Electronics Forum | Mon Jan 20 19:07:41 EST 2003 | slthomas
Sorry, what I meant was that they don't provide a duration for that liquidus + 20�C value that I've seen bantered about here and on TechNet. They only provide the same stock time above liquidus of 30-90 that they've always used. I'd like to see refe
Electronics Forum | Tue Mar 04 16:09:05 EST 2008 | dphilbrick
Everything you wanted to know (and possibly didn't want to know) http://www.freescale.com/files/32bit/doc/package_info/AN2920.pdf
Electronics Forum | Tue Mar 04 17:06:31 EST 2008 | realchunks
Depends on your board? What finish? Solder mask between all pads? What pitch is the part? Will it machine placed? Don't forget proper profiling as well. 1:1 with machine placement should yield no issues.
Electronics Forum | Wed Dec 17 11:25:38 EST 2008 | davef
dots of minimal height. So, use a lower viscosity adhesive. * Higher standoff components => larger (and taller) dots. So, use a high viscosity [typically, also high yield point] adhesive.
Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov
I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil
