Electronics Forum: parameters (Page 26 of 102)

SPC for Wave solder (defects on PCB's)

Electronics Forum | Tue Feb 07 11:26:40 EST 2006 | Cal Kolokoy

At the wave, you should collect data on the critical process parameters. The cliche being, it's better to control your process via SPC versus performing SPC on defect data. Perform a DoE to determine which variable interactions have the greatest eff

SMT line validation

Electronics Forum | Thu Feb 23 02:46:16 EST 2006 | INGE

It isn't an FDA validation. I think Steve has centered the problem. I have already defined all the steps and all the procedures of the process, but now I must run X boards, Y times, through each piece of equipment (as he said before); the question is

solder paste measurement machine

Electronics Forum | Fri Apr 27 10:33:58 EDT 2007 | ck_the_flip

Jeremy, well said! Thanks for "validating" my theory... LOL I agree that the sampling frequency, AND methodology are key things with 3D inspection. 3D will give you some insight onto how your paste (rheology, viscosity, thixotropy)AND process are

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x

Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp

OT: Wavesolder Process Engineer Needed

Electronics Forum | Thu Jul 03 08:55:37 EDT 2008 | andrzej

Hi, I might say I have some experience (1 year) in wave soldering. Yes I have set all parameters to run PCBs through wave solder. Yes, I have run new products on wave solder and had to find solutions for problems encountered. I understand relationsh

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Sat Feb 14 08:30:08 EST 2009 | smartasp

Thank you all for your valuable inputs. Have having done some more investigation we have realized that there is actually no standard as such to which the ROHS components have to be manufactured aside from the contains of substances like PB and al o

Low Silver Solder Problems

Electronics Forum | Thu Aug 27 13:14:49 EDT 2009 | ghepo

I have already told you that is not possible solve this problem by e-mail, without perform a detailed failure analysis. Also I have told you to procede by exclusion. Are you sure, by tests, regarding the PCB quality ? Are you sure regarding the solde

0201 pad layout

Electronics Forum | Fri Jan 06 13:47:15 EST 2012 | davef

Your starting [and finishing] point should be IPC-7351B Land Pattern Calculator and Tools - http://landpatterns.ipc.org/default.asp For more, look here: * http://www.smtnet.com/bob-willis/pbdai.html * http://www.onboard-technology.com/pdf_novembre

Juki / Zevatech 730/740 - MS Parameters window

Electronics Forum | Tue Apr 30 21:13:43 EDT 2019 | marcarmo

Caro amigo Charlien poderia me dizer como proceder o item 11? do arquivo pdf ms parameter window? para mover a cabeça para bloco de calibração? deve ter algum comando ou atalho no teclado para movimentar a cabeça dela e baixar a cabeça até nivel de c

Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik

Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads


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