Electronics Forum: parameters (Page 76 of 102)

JUKI configuration file locatioon

Electronics Forum | Fri Jul 29 06:48:11 EDT 2022 | jojoled

I have old JUKI machine, which after power loss seems to have corupted configuration file(all works fine,except Vision configuration for fiducial recognition : camera is unable to read/ write parameters for Vision), can anybody help to tell which fil

Training Request on ASM Eagle Xtreme gold wire bonder

Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg

Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b

Stencils

Electronics Forum | Wed Aug 09 15:06:17 EDT 2023 | SMTA-64386426

The first thing I do when looking at a part relative to stencil design, is determine the coplanarity per the data sheet. Ideally your stencil thickness should be equal to, or if needed, greater than the coplanarity. You want the solder paste to com

exessive yellow-gold coloring in the solder pot with tin-silver-copper alloy

Electronics Forum | Mon Sep 25 15:32:21 EDT 2023 | joeljacobo

hello colleagues, Hoping that everyone is doing well, I am reaching out to you in the hope that your experience can help me. We have a wave solder with sac0307 alloy and the pot has turned a golden color, at first I thought it was common tin oxidat

Reflow soldering of lead-free components with leaded solder paste

Electronics Forum | Fri Feb 16 09:01:05 EST 2024 | emanuel

I am confused about the parameters of the reflow profile needed to solder lead free components. We assemble boards for automotive modules required with leaded solder paste. The boards have ENIG finish. The problem is that I see some wetting issues, v

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal

For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o

Re: Exhausting of flux in reflow ovens

Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima

| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be

Re: Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Fri May 07 02:29:16 EDT 1999 | Bob Willis

| | I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | | | PROBLEMS | | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometim

Re: Cleaning PCB's after routing

Electronics Forum | Sun May 24 06:02:33 EDT 1998 | Earl Moon

| Hello, | I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. | We have considered pre-drilling the routing plunge points, but cost and ca

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro


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