Electronics Forum | Wed Feb 09 21:19:03 EST 2005 | Mrduckmann2000
Russ, We can not use a wave pallet, already went that route. We have parts next to the thru-hole pins and between thru-hole pins. I am going to try an experiment in the next day or so with solder mask. I plan to solder SMT parts on the back of se
Electronics Forum | Tue Feb 15 06:53:50 EST 2005 | cyber_wolf
It seems that every time we do maintenance on our CP6 windmills, we have a lot of problems with nozzles sticking up inside the holders. It seems to happen for a while, then it goes away after we run for a bit. We follow the Fuji maintenance procedure
Electronics Forum | Wed Feb 23 17:31:33 EST 2005 | Brent Robinson
Nozzle size is probably the main issue, but it could be a problem with the vacuum level too. Vacuum level should be a minimun of 20 in HG. Also verify that you have 85 PSI going into the machine. A lot of times, the paste in the nozzle is due to t
Electronics Forum | Sun Feb 27 17:30:19 EST 2005 | pmdeuel
I�m sure the 10MPF is not a correct nozzle to use. I don�t have manuals handy so I can�t answer as to the correct nozzle. We use a HSP 4792 to place all of our passive parts so I have never given this much thought. But the machine will not try to pla
Electronics Forum | Wed Mar 30 15:16:35 EST 2005 | Rashid
Hi, I've measured a rework profile on a summit 750. my nearby parts are heating up as high as 178 to 182 degrees C. I'm concerned that this fine pitch parts that are nearby are affected specially their solder joints going to close to melting point.
Electronics Forum | Mon Jun 06 09:05:02 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Mon Jun 06 10:02:39 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Thu Jun 23 15:31:46 EDT 2005 | james
The ideas so far are good, but yet remember, we are running 4 different lines with "1" set of parts that are never removed from the feeders. We can not get purchasing to buy extra reels of the of the most used parts, and these parts travel from line
Electronics Forum | Wed Jun 29 17:56:47 EDT 2005 | Ryan
We have a new Heller 1809 EXL reflow oven and when we run MELF�s or Aluminum Electrolytic Capacitors through the oven they are being blown off the pads. I have verified that the placement is good before reflow. I verified that they are pushed down
Electronics Forum | Tue Jul 05 16:29:27 EDT 2005 | stepheniii
The air kiss is to replace the vacuum with air so the part will drop off the nozzle. Every machine I've seen with Air kiss, uses it when discarding a part as well as when placing a part. The air kiss should not be strong enough to blow the nozzle off
