Electronics Forum | Wed Sep 22 10:33:17 EDT 1999 | Boca
| which is the best way to catch defects online? | In circuit Tester or Vision System | Carlos, It depends on the defect you're trying to catch. Vision systems can be good at catching missing, reversed, wrong (if marked) parts. ICT is good with el
Electronics Forum | Fri Sep 10 13:50:24 EDT 1999 | Jose RG
We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with o
Electronics Forum | Fri Sep 10 14:29:48 EDT 1999 | Doug Philbrick
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Wed Sep 08 13:36:27 EDT 1999 | Wolfgang Busko
| Hello: | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven. When
Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX
| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than
Electronics Forum | Tue Jul 27 16:08:04 EDT 1999 | Kathleen at ATL
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the perime
Electronics Forum | Thu Jul 22 04:53:54 EDT 1999 | George Verboven
| Looking for a cross-referencing and part identification guide for surface-mount components. There is very little infomation provided on some of the components themselves, and we often don't have parts lists or schematics for items we repair, so ide
Electronics Forum | Sat Jul 17 17:42:02 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
