Electronics Forum: part (Page 276 of 1117)

Re: Removing Component Part Number

Electronics Forum | Thu Mar 02 18:15:01 EST 2000 | Stu Leech

How is the component marked. Is it ink marked, laser marked or what? What is the material that the marking on? What volume are you looking at? We used a small, pencil-sized sand blaster, loaded with bicarbonate of soda to errode the mark off of plast

Heat sinking delicate leaded parts

Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner

I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei

Re: ENIG finishing

Electronics Forum | Mon Feb 14 11:58:30 EST 2000 | JAX

Steve, I have just one question. Do you place any other QFP's that have 20mil pitch or less? Do you see the same problems? You might be able to solve the problem using other methods. If not, will the ENIG finish on the boards be a profitable move. I

Re: Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 16:47:41 EST 2000 | Michael Parker

It is apparent that you have evaporated the flux before you reflowed. You got lucky when the paste slumped and you didn't get major problems elsewhere. A more reliable solution is to adjust the stencil apertures for the part that is experiencing bri

Re: 0402 pick problems

Electronics Forum | Mon Nov 27 17:59:56 EST 2000 | Dave F

Sounds like "place" problem doenit? As best as I can tell [ever notice how the trail get fuzzy pretty fast, when someone starts asking probing questions], we received someone caps manufactured by someone other than Rolm through a distributor. The p

Re: Mixed Technology

Electronics Forum | Fri Oct 06 09:25:57 EDT 2000 | Kev Head

Most places I've seen don't do anything special. But then again most places only have chip components on the bottom of their boards along with some thru-hole. The best way to find out if you are going to delaminate is to talk to the board manufactu

Re: Equipment/Line Capability Study

Electronics Forum | Tue Sep 26 11:03:00 EDT 2000 | Wolfgang Busko

Greg: You might look for : - smallest board size - largest board size - finest pitch you are able to handle (safe) - Parts/hour - units/hour (If you find your bottleneck it will be easy to determine) - number and kind of feeders, components per line

Re: Solder woes

Electronics Forum | Thu Aug 10 13:30:54 EDT 2000 | Bob Willis

Solder skips on SOT23 parts is the most common issue when soldering surface mount designs. The two most common causes are the wave height too low or there is too much gassing of the flux as it contacts and seperates the wave. Stck some parts on your

Re: Fuji PD Development

Electronics Forum | Mon Jun 26 12:48:07 EDT 2000 | JAX

Matt, I assume you mean F4G. This comes as a complete packadge...worth the look, but.......... You might want to look at changing your PD naming convention. I can't imagine having so many new types of parts that you are being overwhelm

Re: Fuji PD Development

Electronics Forum | Wed Jul 05 22:29:06 EDT 2000 | George

Matt, I suppose the automated system you refer to is the VPD-101 camera system that captures component image and with a few clicks on the mouse you are able to define all the element data and dimensions of that part. Check with your local Fuji agent,


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