Electronics Forum | Wed Jun 28 13:45:20 EDT 2000 | Paul Wright
A portion of our business is quick turn prototypes. The difficult part of doing this effectively is component descriptions. One customer will call a component SSOP-20, another will call his SSOP-20 but the lead pitch will be different, another wil
Electronics Forum | Thu Jun 29 09:45:27 EDT 2000 | Paul Wright
JAX, I want to eliminate as much of the confusion up front. If I can point all the folks involved in the design and manufacture to a single source for component descriptions, be it a TI data book, IPC or JEDEC standard, or some other source, I think
Electronics Forum | Tue May 30 08:24:23 EDT 2000 | David Lazarus
Could some of you give me ideas where I could find articles or studies about market or player performance in the SMT/through hole industry (specifically, OEM's for the automotive industry)? I am part of design team for a scholastic design project at
Electronics Forum | Fri May 19 14:33:30 EDT 2000 | Lawrence A. Groves
I did this at one point and found that the handleing is critical. What usually happened is that two of the PCBs would touch and the edge of one would scrape the parts off the other. I tried a couple of different epoxys and ended up with a CIBA prod
Electronics Forum | Wed May 17 12:22:54 EDT 2000 | JAX
Ramot, Without further explanation everyone here is just taking stabs at it..... Sounds normal, I'm game! Have you looked at board finish(HASL?)?? Measured paste height?? Are they always off in the same direction? If not, Handling?? What are the sp
Electronics Forum | Sun Apr 30 22:29:23 EDT 2000 | Jack
We use Fujicam for FUJI CP643 programming and optimizing in our plant. There are about 800 parts (80% chips and 20% lead components) being placeed by 2 CP643. When using Fujicam automaticly allocate feeders and optimize insert order, I got 29000 cph
Electronics Forum | Sat Apr 22 13:54:02 EDT 2000 | JAX
What's Up Big Man, Although I agree with a few things Dean said, personally I like back-light. But since you probably won't listen to me here's is the suggested info: Lead_check area= 60% Vision type= 120 P_pattern= 34 This rest is part dependant
Electronics Forum | Fri Apr 07 16:04:34 EDT 2000 | John
Anyone out there using solder paste (dispense) on through hole technology parts? I would like to know how it's working out for you. Which method or technique are you using? Have you ever tried to dispense on the component side and place through the d
Electronics Forum | Tue Apr 04 03:44:36 EDT 2000 | Jacqueline Coia
Why not? The same system is already successfully used in other areas of industry, we are already familiar with Labview applications as they are implemented for some of our functional tests. From what I have seen so far it seems viable and less expe
Electronics Forum | Mon Mar 27 19:29:14 EST 2000 | Garo Donabedian
I ran six boards with uBGA, and all six have voids 25-30%. I would like to know what would cause this since this is my first time running into this problem. also I would like to know how does a void effect the components function the customer does no
