Electronics Forum: part (Page 546 of 1117)

Re: CP4-2 XY Table

Electronics Forum | Tue Dec 07 22:05:19 EST 1999 | sin

Added to MARK suggestion, you should verify you xy table height also by using the meter listed in the maintenace manual. If everything is fine, then i suggest you should check the placement air kisses( can suck your component back up or release to q

Welcome Back Dave F!

Electronics Forum | Wed Dec 01 15:35:35 EST 1999 | Keith Luke

I just wanted to post a note of thanks and appreciation to Dave F for his tireless work and support in contributing to the Electronics Forum. Dave, your insight and experience have been a big part of our success, and on behalf of the staff here at S

Siemens ( Siplace ) BGA inspection

Electronics Forum | Fri Nov 19 13:37:10 EST 1999 | JAX

I have recently started programming Siemens equipment (Monday) and am a little confused on some issues. When inspecting BGA packages does the machine locate a corner ball and use it as an anchor to locate the rest? If not how does it know that it has

Re: Double sided parts stuffing

Electronics Forum | Mon Nov 22 10:15:50 EST 1999 | Boca

Will, Wolfgang and Deon are exactly right on target. You just have to watch which side is built first. I began doing double sided reflow like this in the mid '80's, it works great. I used FR4/ GT material to hold the PCB up off of the conveyor,

Re: Placement Equipment for 17 x 23 Backplanes?

Electronics Forum | Tue Nov 23 15:37:30 EST 1999 | Rob Horowitz

Give Contact Systems a call. A standard Contact machine will fit boards as large as 26" x 18", and place parts at a rate of 13,000 CPH. They have both new and refurbished machines to fit within your budget. I would certainly not recommend going less

Re: SMD packages dimensions and solder land information

Electronics Forum | Thu Nov 11 13:03:01 EST 1999 | Jeff Sanchez

Thanks John, That's a nice site. It had some good training stuff as well. I had seen a thread here on the forum for this same question and someone posted this link www.practicalcomponents.com . It gives all the package sizes and dementions as

Re: Skiming Dross From Solder Pot

Electronics Forum | Wed Nov 10 11:52:50 EST 1999 | Wolfgang Busko

All good points to check. But consider that once you have dross in the pump mechanism it�s hard to get it out quick through normal operation. You might empty the pot and clean it sorrowly to get it out of all corners and parts where it sticks. I had

Bottomside Glued parts

Electronics Forum | Tue Oct 26 11:15:55 EDT 1999 | Morris

I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating the

Re: Collumn Grid Array

Electronics Forum | Sat Oct 23 23:35:26 EDT 1999 | JAX

Phuc, John is correct about the physical dimensions of the part and the problems surrounding them. This does not mean they are a problem for SMT. They can be placed with little trouble by the machines if you can spend the money on the right equipme

Re: Fuji Software for MCS16

Electronics Forum | Thu Oct 14 10:50:51 EDT 1999 | Tony

Carl, The software is available from Fuji America as well. To determine the kit you will require for the upgrade, you need to know what size hard drive you have in your system and then visit the FAC web page for a part number and pricing. http://w


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