Electronics Forum | Thu May 16 12:49:29 EDT 2002 | stefwitt
FAI appears to become fashionable in the Bay area. FAI on double side sticky tape is the first one I hear about. How does the customer test the functionality of the board, when the board is not soldered?. Components are not wasted for FAI. Wrong part
Electronics Forum | Mon May 27 12:55:28 EDT 2002 | jgeissler
We are experiencing an increased amount of machine stoppage due to brittle 8mm cover tape. The issue does not appear to be feeder or part/manufacturer specific. Taking a foot of cover tape and pulling it from the ends results the cover tape snappin
Electronics Forum | Mon Jun 03 22:16:49 EDT 2002 | alex_kirichenko
Hi Jim! Just an idea.... There are some reflow ovens which use cooling on the bottom side of pcb during reflow for doublesided boards. It prevents solder on the bottom side to melt. You might try cooling your BGA while reflowing parts on opposit s
Electronics Forum | Thu May 30 11:37:27 EDT 2002 | Ron Costa
Hi Ray, A couple of things to look into: 1.date code of reel 2. what is the termination made up of tin/lead or tin/lead/palladium. Check with part manufacturer. 3.paste volume/aperture openings 4.PCB plating 5.solder paste formulation Good luck R
Electronics Forum | Fri May 31 14:02:23 EDT 2002 | dougt
Russ We decided to use a PC-104 brd for a piece of equipment and had to make a "PC-104 Adaptor Brd" as it is affectionately known. The actual PC104 connectors came with what they called a solder system, a flat piece of solder with holes in it that w
Electronics Forum | Tue Jun 04 12:26:40 EDT 2002 | Hussman69
If you have solder balls in vias on the "component side" it probably is your wave solder process. Most waves have an option that is designed to make sure your surface mount parts solder - but if turned up too high, can actually push solder up throug
Electronics Forum | Thu Jun 06 13:17:33 EDT 2002 | Hussman69
Don't forget squeegee type and angle. (Am I an Ian wanna be or what?) I'd leave out different types of solder paste. For measurement, use something like a Cyber Centry. It may cost a little, but if you're serious, it's worth it. Other wise you m
Electronics Forum | Wed Jun 12 18:04:47 EDT 2002 | stownsend
Is this a new problem on an old product, or is this a first run? If this is a new problem on an old product, you may want to check the paste process. If the paste is not even across both pads or is offset a bit, the parts will pop up. If this is a f
Electronics Forum | Mon Jul 01 21:55:59 EDT 2002 | Gang shen
oh,sorry,my expresion is not clear.the problem is that about one sixties of BGA is deviation from the proper position one line. my place machine is IP3,the part data of the BGA is okay(in my opinion),our "test vehicle" is poor just by human eyes,with
Electronics Forum | Tue Jul 02 14:45:20 EDT 2002 | bentzen
Hi Greg. As a subcontractor, not able to control the part design, you are in trouble. I�m not sure, but maybe use of the graphical shape library could be a solution. This library can be used to ensure correct zero degree rotation and it migth be p
