Electronics Forum: part (Page 566 of 1117)

double sided reflow criteria

Electronics Forum | Mon Feb 03 18:37:28 EST 2003 | jonfox

Not to be off-topic, but push engineering for embedded passives and remove parts from the underside all together. Watch the material cost sky rocket, but watch the manufacturing cost sink and well as improve the production cycle by 50%. Sorry, I w

Tombstoning in Vapor Phase Process

Electronics Forum | Mon Feb 03 23:55:58 EST 2003 | MA/NY DDave

Hi If this is the tombstoning I know which is evidenced by parts touching each other and some obvious colored material at the edges just wash them again real good. Now you might want to do some IR tests just in case you will have a reliability hit.

Ceramic capacitors cracking

Electronics Forum | Wed Feb 05 12:14:55 EST 2003 | slthomas

Increasing the score depth enough to make manual depaneling safe may very well make the panel useless, depending on your automated processes and handling requirements and methods. We use depanelers daily, hourly, even. We prefer to route the boards

Epoxied Parts Falling Off

Electronics Forum | Tue Feb 25 15:29:46 EST 2003 | MA/NY DDave

Hi Locktite is telling you to cure first, maybe for a good reason. So the epoxy becomes stable just before solder reflow moves stuff around and around and then settles. A WEG yet if you did some cross sections and analysis you might find piles of

Epoxied Parts Falling Off

Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave

Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren

When is BGA Reballing not recommended?

Electronics Forum | Tue Feb 25 20:10:33 EST 2003 | davef

First, there is no standard. Next, on one hand, most BGA cost a lot of money. On the other hand, choosing to use reballed BGA in products for shipment depends on how well you expect to meet your customers' expectations about product reliability wit

IPC-9850

Electronics Forum | Thu Mar 06 14:10:26 EST 2003 | gregp

Hello Mike, The IPC has recently released a specification (IPC-9850) that characterizes the performance of placement machines. The process is very similar to the process you describe (placing parts on a glass plate and measuring the results). The I

First Article Software

Electronics Forum | Fri Mar 14 13:09:33 EST 2003 | Dman

Does anyone know of any free software that would allow an inspector to look for a reference designator on a densely-populated PCB? The software would need to accept a CAD pick'n'place file as input, and highlight the part when the inspector enters t

Touch up paint for Universal GSM

Electronics Forum | Mon Mar 31 17:59:25 EST 2003 | mgc

Universal Customers are always welcome to use any of our available support options to obtain services or parts. I have attached the link to our web shopping site where I am certain that you may obtain the touch up paint you need. http://www.uic.com

Stencil Design for Resistor Net Array 0402

Electronics Forum | Wed Mar 26 19:11:52 EST 2003 | russ

Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't have to change apertures for any component based upon its rotation. the parts that are coming out good could they withstand a higher volume print? You


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