Electronics Forum | Mon Dec 22 18:20:33 EST 1997 | Graham Naisbitt
Brett and Chis, The method I understand to be the most popular is the use of micro-blasting or abrasion. In other words mechanical rather than chemical removal. However, that is only part of the problem - how do you repair the coating? The technique
Electronics Forum | Tue Dec 16 14:48:03 EST 1997 | Justin Medernach
| Q1. | As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. | Ultimately I will be setting up control charts on line. | Does anybody have suggestions in this area ?, I h
Electronics Forum | Thu Aug 23 20:51:15 EDT 2001 | davef
Every thing you need is in "links" here http://packaging.hp.com/. The only thing you need to do now is find it. Ah, so much information, so little time. Yeh yeh yeh, nice little ESD bags are good. Er, maybe sealed barrier bags might be better. E
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Tue Sep 25 09:56:09 EDT 2001 | nwyatt
Hi, thanks for your input. Yes, we do have a rework station - specifically a SRT Summitt 1000 station, but it causes us many problems and is down more than it's up...I do not think that using it would speed up the process at all. As far as accuracy
Electronics Forum | Wed Oct 03 17:07:52 EDT 2001 | davef
We have had soldering problems with fine pitch QFP in the past [and probably will in the future]. Several questions leap to mind: * When you took your profile on the component pads, do you profile on the pads that did not solder well? * When you say
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Wed Nov 28 20:14:50 EST 2001 | ianchan
Hi, i'd second that choice of enineering degree in electronics as monkey says, coz of variable options open to you IF you decide to rotate in your field of applicable enggr interests... IT courses are abundant in today's "open Uni" learning "econom
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
